At Xinfeng Huihe(hhetech), we specialize in advanced High-Density Interconnect (HDI) manufacturing, delivering the precision required for next-generation electronics. From complex 1+N+1,2+N+2, 3+N+3 and ELIC stackups, our fabrication processes are built for performance and durability.
We understand the stakes of your project. That is why our manufacturing excellence is backed by rigorous quality standards, including ISO 13485 and IATF 16949 certifications. Whether your project is for life-saving medical devices or demanding automotive systems, we provide the technical expertise and supply chain stability you need to bring your product to market with confidence.
According to IPC-2226,HDI (High Density Interconnect) PCB is defined as a wiring density per unit area higher a traditional pcb. It(HDI PCB) designed for high-density applications where space is limited. This technology allows for more components to be placed on a smaller surface area, making it ideal for devices with advanced functionality in compact form factors.
HDI PCBs are characterized by their use of microvias, blind vias, and buried vias, which allow for the routing of traces between layers without taking up valuable real estate on the outer layers of the board. This results in a higher component density, better signal integrity, and improved electrical performance.
The increased complexity of HDI PCBs requires advanced manufacturing techniques such as laser drilling and sequential lamination to achieve the desired layer stack-up. These processes allow for tighter tolerances and finer features, resulting in a more reliable and efficient board.
HDI PCB technology is revolutionizing the electronics industry by enabling smaller, lighter, and more powerful devices.
HDI PCBs are typically used in applications where space is limited and signal integrity is critical. With their high density of interconnections, these boards can support advanced technologies such as microvia structures, blind and buried vias, and fine pitch components. This allows for increased functionality and performance in a compact form factor.
In addition to their use in consumer electronics, HDI PCBs are also utilized in the aerospace and defense industries, where reliability and performance are key considerations. These boards are able to withstand harsh environments and operate at high speeds, making them well-suited for mission-critical applications.
The field of application for HDI PCBs is vast and diverse, encompassing a wide range of industries that require high-performance electronic solutions. From cutting-edge communication devices to advanced medical equipment, these specialized circuit boards play a crucial role in enabling the development of innovative technologies that drive progress and improve quality of life.
There are several types of HDI PCB stack up designs, each tailored to meet specific requirements and constraints. The most common types include 1+N+1, 2+N+2, 3+N+3..and Every Layer InterConnect(ELIC) stack ups. The numbers in these designations represent the number of layers of vias that connect the various layers of the PCB.
In a 1+N+1 stack up, there is a single layer of vias connecting two outer layers of the PCB. This design is suitable for simpler applications with moderate density requirements.
A 2+N+2 stack up includes two layers of vias connecting three outer layers, allowing for increased routing flexibility and higher density components.
The 3+N+3 stack up offers even greater design flexibility with three layers of vias connecting four outer layers.Every Layer InterConnect(ELIC) means that are able to have interconnects on every layer of the board.
The choice of HDI PCB stack up design type depends on factors such as the complexity of the circuit, the size constraints of the device, and the required performance specifications. Designers must carefully consider these factors to ensure optimal signal integrity, power distribution, and thermal management.
The stack up design of an HDI PCB is a critical aspect of the PCB design process, impacting the functionality, reliability, and manufacturability of electronic devices. By choosing the right stack up design type, designers can achieve the desired performance and functionality for their applications.
HDI Layer stack:1+N+1
HDI Layer stack:2+N+2
HDI Layer stack:3+N+3
HDI Layer stack: ELIC
| Category | Technical Specifications |
| Layer Count: | 1 - 32 Layers |
| HDI Structure: | 1+N+1, 2+N+2, 3+N+3, 4+N+4, ELIC (Every Layer Interconnect) |
| Base Material: | FR-4 (Standard, High-Tg, Halogen-Free), High Speed/Low Loss, Metal Core (MCPCB) |
| Min. Trace Width/Spacing: | 2/2 mil (50/50 μm) |
| Min. Laser Via Diameter: | 0.075 mm (3 mil) |
| Min. Mechanical Drill Size: | 0.15 mm (6 mil) |
| Aspect Ratio: | 12:1 (Through-hole); 1:1 (Microvia) |
| Via Technology: | Blind & Buried Vias, Stacked Vias, Staggered Vias, Via-in-Pad (VIPPO) |
| Via Filling: | Conductive Epoxy, Non-conductive Epoxy, Copper Paste, Copper Plated Shut |
| Copper Weight: | 0.5 oz - 6 oz (Outer/Inner) |
| Board Thickness: | 0.4 mm - 6.0 mm |
| Max. Panel Size: | 610 mm x 1200 mm |
| Impedance Control: | ±5% (Strict) / ±10% (Standard) |
| Surface Finishes: | ENIG (Electroless Nickel Immersion Gold), ENEPIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, Lead-Free HASL |
| Quality Standards: | IATF 16949 (Automotive), ISO 13485 (Medical), ISO 9001, IPC-A-600 Class 2/3 |
We source premium laminates from world-class suppliers like Rogers, Isola, and Panasonic to ensure signal integrity for 5G, medical imaging, and automotive ADAS systems
| Application Type | Recommended Material Brands & Models |
| High-Tg / Reliability | Shengyi (SY): S1000-2, S1170G ITEQ: IT180A, IT170G Ventec: VT-47, VT-481 |
| High Speed / Low Loss | Panasonic: Megtron 4 (M4), Megtron 6 (M6), Megtron 7 (M7)Isola: 370HR, Tachyon 100G, I-Speed Doosan: DS7409D, DS7409DV |
| High Frequency (RF) | Rogers: RO4350B, RO4003C, RO3003, RT/duroid series Taconic: TLX series, TLY series Arlon: AD series, TC series |
| Halogen-Free | Shengyi: S1155, S1165 ITEQ: IT-150G, IT-170GRA1 |
| Automotive Grade | Materials compliant with IATF 16949 for thermal cycling and high-power applications (e.g., NanYa, Kingboard High-Tg series) |
1.A Complete Guide to 1+n+1, 2+n+2, and 3+n+3 Stackups
2.Laser Microvia vs. Mechanical Drilling: Cost and Precision Analysis
3.How to Optimize Impedance Control in High-Speed HDI Designs
4.Top 5 Common DFM Issues in BGA Routing